ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 29, 2026 EDT
Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 Die
Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 Die
Couts, Philip. 2026. “Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 Die.” IMAPSource Proceedings 2009 (Symposium): 1046–53. https://doi.org/10.4071/001c.161493.