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ISSN 2380-4505
Symposium Proceedings
Vol. 2009, Issue Symposium, 2009May 11, 2026 EDT

Indium Thermal Interface Material Assembly Manufacturability and Reliability

Sean S. Too, Mohammad Khan, Edwin Goh, Xiaole Zhoa, Kee-Hean Keok,
thermalindiuminterfaceassemblymanufacturabilityreliability
https://doi.org/10.4071/001c.162061
IMAPSource Conference Papers
Too, Sean S., Mohammad Khan, Edwin Goh, Xiaole Zhoa, and Kee-Hean Keok. 2026. “Indium Thermal Interface Material Assembly Manufacturability and Reliability.” IMAPSource Proceedings 2009 (Symposium): 440–45. https://doi.org/10.4071/001c.162061.
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