Microspring Characterization and Flip Chip Assembly Reliability

B. J. Cheng; E.M. Chow; D. DeBruyker; C. Chua; K. Sahasrabuddhe; I. Shubin; J. Cunningham; Y. Luo; A. V. Krishnamoorthy

doi:10.4071/001c.162074

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Cheng, B. J., E.M. Chow, D. DeBruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. Cunningham, Y. Luo, and A. V. Krishnamoorthy. 2026. “Microspring Characterization and Flip Chip Assembly Reliability.” IMAPSource Proceedings 2009 (Symposium): 492–99. https://doi.org/10.4071/001c.162074.

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