ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009June 22, 2026 EDT
Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plated Printed Circuit Boards
Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plated Printed Circuit Boards
Jennings, Jeffrey M., Donna Gerrity, Carlyn Smith, and Patricia Olszewski. 2026. “Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plated Printed Circuit Boards.” IMAPSource Proceedings 2009 (Symposium): 760–67. https://doi.org/10.4071/001c.163718.