Effect of Germanium addition to Sn3.5Ag Lead Free Solder System for Overall BGA Package Robustness Improvement

Eu Poh Leng; Wong Tzu Ling; Min Ding; Nowshad Amin; Ibrahim Ahmad; Tay Yee Han; A.S.M.A. Haseeb

doi:10.4071/001c.160911

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Leng, Eu Poh, Wong Tzu Ling, Min Ding, Nowshad Amin, Ibrahim Ahmad, Tay Yee Han, and A.S.M.A. Haseeb. 2026. “Effect of Germanium Addition to Sn3.5Ag Lead Free Solder System for Overall BGA Package Robustness Improvement.” IMAPSource Proceedings 2009 (Symposium): 150–57. https://doi.org/10.4071/001c.160911.

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