ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 27, 2026 EDT
A Coupling between Electromigration(EM) and Kirkendall Effect in Sn-3.5Ag/Cu Solder Joint
A Coupling between Electromigration(EM) and Kirkendall Effect in Sn-3.5Ag/Cu Solder Joint
Kang, H.W., Jin Yu, and Y. Jung. 2026. “A Coupling between Electromigration(EM) and Kirkendall Effect in Sn-3.5Ag/Cu Solder Joint.” IMAPSource Proceedings 2009 (Symposium): 558–62. https://doi.org/10.4071/001c.162592.