ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 11, 2026 EDT
Micron Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic Products
Micron Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic Products
Evans, Daniel D., and Zeger Bok. 2026. “Micron Level Placement Accuracy for Wafer Scale Packaging of P-Side Down Lasers in Optoelectronic Products.” IMAPSource Proceedings 2009 (Symposium): 420–25. https://doi.org/10.4071/001c.162057.