Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics

Joe Kreuzpaintner; Karen Wooldridge; Donna Gerrity; Bill Clark; Hector Deju

doi:10.4071/001c.163723

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Kreuzpaintner, Joe, Karen Wooldridge, Donna Gerrity, Bill Clark, and Hector Deju. 2026. “Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics.” IMAPSource Proceedings 2009 (Symposium): 776–81. https://doi.org/10.4071/001c.163723.

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