ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 29, 2026 EDT
Thermal Characteristics for LSI Embedding Build-up PWBs
Thermal Characteristics for LSI Embedding Build-up PWBs
Amakai, Shin-ya, Tsuyoshi Tsunoda, Kohei Ohta, Shuji Sagara, and Yoshitaka Fukuoka. 2026. “Thermal Characteristics for LSI Embedding Build-up PWBs.” IMAPSource Proceedings 2009 (Symposium): 601–8. https://doi.org/10.4071/001c.162666.
