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ISSN 2380-4505
Symposium Proceedings
Vol. 2009, Issue Symposium, 2009May 29, 2026 EDT

Thermal Characteristics for LSI Embedding Build-up PWBs

Shin-ya Amakai, Tsuyoshi Tsunoda, Kohei Ohta, Shuji Sagara, Yoshitaka Fukuoka,
LSI embeddingthermal characteristicthermal conductivityheat spreadingsimulation
https://doi.org/10.4071/001c.162666
IMAPSource Conference Papers
Amakai, Shin-ya, Tsuyoshi Tsunoda, Kohei Ohta, Shuji Sagara, and Yoshitaka Fukuoka. 2026. “Thermal Characteristics for LSI Embedding Build-up PWBs.” IMAPSource Proceedings 2009 (Symposium): 601–8. https://doi.org/10.4071/001c.162666.
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