ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009April 20, 2026 EDT
Evaluation of Electroless Nickel Electroless Palladium (ENEP) finish as a replacement for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) for Gold Wirebonding and SAC305 Solderability
Evaluation of Electroless Nickel Electroless Palladium (ENEP) finish as a replacement for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) for Gold Wirebonding and SAC305 Solderability
Gandhi, Jaspreet, Shijian Luo, and Tom Jiang. 2026. “Evaluation of Electroless Nickel Electroless Palladium (ENEP) Finish as a Replacement for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) for Gold Wirebonding and SAC305 Solderability.” IMAPSource Proceedings 2009 (Symposium): 079–086. https://doi.org/10.4071/001c.160898.