Analysis of Pb-free BGA Solder Joint Reliability Data

Weidong Xie; Michael Tsai; Kuo-Chuan Liu

doi:10.4071/001c.162591

Loading [Contrib]/a11y/accessibility-menu.js

Xie, Weidong, Michael Tsai, and Kuo-Chuan Liu. 2026. “Analysis of Pb-Free BGA Solder Joint Reliability Data.” IMAPSource Proceedings 2009 (Symposium): 552–57. https://doi.org/10.4071/001c.162591.

View more stats