ISSN 2380-4505
Vol. 2009, Issue Symposium, 2009May 27, 2026 EDT
Wafer Level Batch Fabrication of Silicon Microchannel Heat Sink and Electrical Through-Silicon Vias for 3D ICs
Wafer Level Batch Fabrication of Silicon Microchannel Heat Sink and Electrical Through-Silicon Vias for 3D ICs
Zaveri, Jesal, Calvin R. King, Hyung Suk Yang, and Muhannad S. Bakir. 2026. “Wafer Level Batch Fabrication of Silicon Microchannel Heat Sink and Electrical Through-Silicon Vias for 3D ICs.” IMAPSource Proceedings 2009 (Symposium): 579–84. https://doi.org/10.4071/001c.162596.