ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 28, 2026 EDT
Vertical Interconnects Using Magnetically Aligned Anisotropic Conductive Adhesive for RF Packaging
Vertical Interconnects Using Magnetically Aligned Anisotropic Conductive Adhesive for RF Packaging
Moon, Sungwook, and William J. Chappell. 2026. “Vertical Interconnects Using Magnetically Aligned Anisotropic Conductive Adhesive for RF Packaging.” IMAPSource Proceedings 2008 (Symposium): 970–74. https://doi.org/10.4071/001c.165914.