ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 23, 2026 EDT
Filler Dispersion in Epoxy Mold Compound and Its Effect on the Reliability of Cu/Low-k Devices in Plastic Ball Grid Array Packages
Filler Dispersion in Epoxy Mold Compound and Its Effect on the Reliability of Cu/Low-k Devices in Plastic Ball Grid Array Packages
Ding, Min, Tu Anh Tran, Sheila Chopin, Nick Vo, and Peng Su. 2026. “Filler Dispersion in Epoxy Mold Compound and Its Effect on the Reliability of Cu/Low-k Devices in Plastic Ball Grid Array Packages.” IMAPSource Proceedings 2008 (Symposium): 650–57. https://doi.org/10.4071/001c.165466.