Electrochemical Process for Through Via 3D SiP without CMP and Lithographic Processes

Jae-Ho Lee; Suk-Ei Lee; Seong-Hun Kim; Yun-Sung Moon; Yeong-Kwon Ko; Kyoung-Jin Park

doi:10.4071/001c.165298

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Lee, Jae-Ho, Suk-Ei Lee, Seong-Hun Kim, Yun-Sung Moon, Yeong-Kwon Ko, and Kyoung-Jin Park. 2026. “Electrochemical Process for Through Via 3D SiP without CMP and Lithographic Processes.” IMAPSource Proceedings 2008 (Symposium): 434–37. https://doi.org/10.4071/001c.165298.

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