Low Thermal Expansion and High Heat Dissipation Printed Wiring Boards

Sohei Samejima; Sadao Sato; Tsuyoshi Ozaki; Atsushi Inoue; Kentaro Suzuki; Hiroyuki Osuga; Katsuaki Matsui

doi:10.4071/001c.165805

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Samejima, Sohei, Sadao Sato, Tsuyoshi Ozaki, Atsushi Inoue, Kentaro Suzuki, Hiroyuki Osuga, and Katsuaki Matsui. 2026. “Low Thermal Expansion and High Heat Dissipation Printed Wiring Boards.” IMAPSource Proceedings 2008 (Symposium): 889–94. https://doi.org/10.4071/001c.165805.

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