ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 09, 2026 EDT
Thermal Verification of a High-Temperature Power Package Utilizing Silicon Carbide Devices
Thermal Verification of a High-Temperature Power Package Utilizing Silicon Carbide Devices
Shaw, R., B. McPherson, J. Hornberger, A. Lostetter, K. Okumura, and T. Otsuka. 2026. “Thermal Verification of a High-Temperature Power Package Utilizing Silicon Carbide Devices.” IMAPSource Proceedings 2008 (Symposium): 1152–59. https://doi.org/10.4071/001c.164887.