ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 23, 2026 EDT
A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level
A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level
Leng, Eu Poh, Wong Tzu Ling, Nowshad Amin, and Ibrahim Ahmad. 2026. “A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level.” IMAPSource Proceedings 2008 (Symposium): 572–78. https://doi.org/10.4071/001c.165453.