ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008June 26, 2026 EDT
Effects of Pre-pack Thermal Aging on the Formation and Evolution of IMC for Sn-Pb36-Ag2 and Sn-Ag3.8-Cu0.7 and it’s Correlation to Solder Joint Strength
Effects of Pre-pack Thermal Aging on the Formation and Evolution of IMC for Sn-Pb36-Ag2 and Sn-Ag3.8-Cu0.7 and it’s Correlation to Solder Joint Strength
Vemal, R., and M. Hamdi. 2026. “Effects of Pre-Pack Thermal Aging on the Formation and Evolution of IMC for Sn-Pb36-Ag2 and Sn-Ag3.8-Cu0.7 and It’s Correlation to Solder Joint Strength.” IMAPSource Proceedings 2008 (Symposium): 086–093. https://doi.org/10.4071/001c.164091.