Highly Reworkable Board-Level Underfill for Large PoP Devices

Alisha Adams; Ian Cole; Paul Morganelli; Joe Ferreira; Patrick O’Malley; Bryon Stevens; Xinnan Zhang; Andrew Collins

doi:10.4071/001c.164868

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Adams, Alisha, Ian Cole, Paul Morganelli, Joe Ferreira, Patrick O’Malley, Bryon Stevens, Xinnan Zhang, and Andrew Collins. 2026. “Highly Reworkable Board-Level Underfill for Large PoP Devices.” IMAPSource Proceedings 2008 (Symposium): 1090–96. https://doi.org/10.4071/001c.164868.

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