ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 27, 2026 EDT
Wafer Level Packaging: Balancing Device Requirements and Materials Properties
Wafer Level Packaging: Balancing Device Requirements and Materials Properties
Farrens, Shari, and Sumant Sood. 2026. “Wafer Level Packaging: Balancing Device Requirements and Materials Properties.” IMAPSource Proceedings 2008 (Symposium): 770–77. https://doi.org/10.4071/001c.165747.