ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 27, 2026 EDT
Estimation of Interconnect Models of SIP (System-in-Package) and POP (Package-on-Package) for IC-Package Co-Analysis and Optimization
Estimation of Interconnect Models of SIP (System-in-Package) and POP (Package-on-Package) for IC-Package Co-Analysis and Optimization
Song, Eunseok, Yunhee Lee, Heeseok Lee, Kiwon Choi, and Sa-Yoon Kang. 2026. “Estimation of Interconnect Models of SIP (System-in-Package) and POP (Package-on-Package) for IC-Package Co-Analysis and Optimization.” IMAPSource Proceedings 2008 (Symposium): 786–90. https://doi.org/10.4071/001c.165754.