Reliability Improvement of Resin Stress Buffer Layer TypeWafer Level Chip Size Package for Automotive Applications

Shunpei Ogaya; Shuichi Tanaka; Haruki Ito; Hirokazu Ito; Nobuaki Hashimoto

doi:10.4071/001c.165477

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Ogaya, Shunpei, Shuichi Tanaka, Haruki Ito, Hirokazu Ito, and Nobuaki Hashimoto. 2026. “Reliability Improvement of Resin Stress Buffer Layer TypeWafer Level Chip Size Package for Automotive Applications.” IMAPSource Proceedings 2008 (Symposium): 706–11. https://doi.org/10.4071/001c.165477.

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