Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies

Nicholas Vickers; Kyle Rauen; Andrew Farris; Jianbiao Pan

doi:10.4071/001c.164093

Loading [Contrib]/a11y/accessibility-menu.js

Vickers, Nicholas, Kyle Rauen, Andrew Farris, and Jianbiao Pan. 2026. “Board Level Failure Analysis of Chip Scale Package Drop Test Assemblies.” IMAPSource Proceedings 2008 (Symposium): 101–7. https://doi.org/10.4071/001c.164093.

View more stats