ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 27, 2026 EDT
Low CTE LCP for Ultra Low Stress Near Hermetic Package for MMIC Applications
Low CTE LCP for Ultra Low Stress Near Hermetic Package for MMIC Applications
Faheem, Faheem F., and Matthew S. Gruber. 2026. “Low CTE LCP for Ultra Low Stress Near Hermetic Package for MMIC Applications.” IMAPSource Proceedings 2008 (Symposium): 760–61. https://doi.org/10.4071/001c.165741.