High Temperature Resistance Conductive Film for RF Grounding Applications

Jing Fan; Art Ackerman; Doug Katze; Jayesh Shah; Matthew Eveline; Nishitha Andra; Daniel Blazej

doi:10.4071/001c.164934

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Fan, Jing, Art Ackerman, Doug Katze, Jayesh Shah, Matthew Eveline, Nishitha Andra, and Daniel Blazej. 2026. “High Temperature Resistance Conductive Film for RF Grounding Applications.” IMAPSource Proceedings 2008 (Symposium): 1204–10. https://doi.org/10.4071/001c.164934.

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