ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 21, 2026 EDT
RF MEMS Flip-chip Package Design: Finite Element Modeling and Experimental Verification
RF MEMS Flip-chip Package Design: Finite Element Modeling and Experimental Verification
Sun, Li, Shawn Cunningham, Art Morris, Changsoo Jang, and Bongtae Han. 2026. “RF MEMS Flip-Chip Package Design: Finite Element Modeling and Experimental Verification.” IMAPSource Proceedings 2008 (Symposium): 546–52. https://doi.org/10.4071/001c.165368.