Heavy Aluminum Wire Wedge Bonding on LTCC Substrate for Automotive Electronics

Je-Hong Sung; Jin-Waun Kim; Yun-Huek Choi

doi:10.4071/001c.163846

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Sung, Je-Hong, Jin-Waun Kim, and Yun-Huek Choi. 2026. “Heavy Aluminum Wire Wedge Bonding on LTCC Substrate for Automotive Electronics.” IMAPSource Proceedings 2008 (Symposium): 039–043. https://doi.org/10.4071/001c.163846.

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