High Reliable Resin Core Bump Technology for 20μm pitch COG (Chip on Glass) Interconnection

Haruki Ito; Shuichi Tanaka; Hideo Imai; Shinji Mizuno; Nobuaki Hashimoto; Akira Makabe

doi:10.4071/001c.165352

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Ito, Haruki, Shuichi Tanaka, Hideo Imai, Shinji Mizuno, Nobuaki Hashimoto, and Akira Makabe. 2026. “High Reliable Resin Core Bump Technology for 20μm Pitch COG (Chip on Glass) Interconnection.” IMAPSource Proceedings 2008 (Symposium): 489–95. https://doi.org/10.4071/001c.165352.

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