Lead-Free Solder Ball Attach Improvement on FCPBGA with SOP Pad Finishing

Wong Tzu Ling; Eu Poh Leng; Nowshad Amin; Ibrahim Ahmad

doi:10.4071/001c.165456

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Ling, Wong Tzu, Eu Poh Leng, Nowshad Amin, and Ibrahim Ahmad. 2026. “Lead-Free Solder Ball Attach Improvement on FCPBGA with SOP Pad Finishing.” IMAPSource Proceedings 2008 (Symposium): 595–602. https://doi.org/10.4071/001c.165456.

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