ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 28, 2026 EDT
Investigation of Fracture Toughness and Displacement Fields of Copper/Polymer Interface Using Image Correlation Technique
Investigation of Fracture Toughness and Displacement Fields of Copper/Polymer Interface Using Image Correlation Technique
Shirangi, M.H., A. Gollhardt, A. Fischer, W.H. Müller, and B. Michel. 2026. “Investigation of Fracture Toughness and Displacement Fields of Copper/Polymer Interface Using Image Correlation Technique.” IMAPSource Proceedings 2008 (Symposium): 917–23. https://doi.org/10.4071/001c.165900.
