ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008June 26, 2026 EDT
A Comparative Study: Thermosonic Bonding of Flip Chips with Gold Stud Bumps to a Variety of Organic Substrates
A Comparative Study: Thermosonic Bonding of Flip Chips with Gold Stud Bumps to a Variety of Organic Substrates
Stolper, Nick, and Fei Ding. 2026. “A Comparative Study: Thermosonic Bonding of Flip Chips with Gold Stud Bumps to a Variety of Organic Substrates.” IMAPSource Proceedings 2008 (Symposium): 198–205. https://doi.org/10.4071/001c.164113.