3-D Corner Delamination Analysis for Fan-Out Chip Scale Package

Tz-Cheng Chiu; Huang-Chun Lin; Stoke Chen; G. S. Shen

doi:10.4071/001c.165473

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Chiu, Tz-Cheng, Huang-Chun Lin, Stoke Chen, and G. S. Shen. 2026. “3-D Corner Delamination Analysis for Fan-Out Chip Scale Package.” IMAPSource Proceedings 2008 (Symposium): 687–93. https://doi.org/10.4071/001c.165473.

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