ISSN 2380-4505
Eidner, I., K. Buschick, L. Dietrich, K. L. Pan, M. Minkus, M. J. Wolf, O. Ehrmann, and H. Reichl. 2026. “Bump on Flexible Lead for Wafer Level Packaging.” IMAPSource Proceedings 2008 (Symposium): 950–55. https://doi.org/10.4071/001c.165911.
