Challenges in Cavity-Down Thermally Enhanced Packages Containing Low-k Dies

Chu-Chung (Stephen) Lee; Tu Anh Tran; Yuan Yuan

doi:10.4071/001c.165474

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Lee, Chu-Chung (Stephen), Tu Anh Tran, and Yuan Yuan. 2026. “Challenges in Cavity-Down Thermally Enhanced Packages Containing Low-k Dies.” IMAPSource Proceedings 2008 (Symposium): 694–700. https://doi.org/10.4071/001c.165474.

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