WLCSP Mechanical Reliability - High Speed Pull Testing (Lead-Free Solder Alloys and Electroless Nickel UBM)

Andrew Strandjord; Thorsten Teutsch; Axel Scheffler; Thomas Oppert; Elke Zakel

doi:10.4071/001c.164094

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Strandjord, Andrew, Thorsten Teutsch, Axel Scheffler, Thomas Oppert, and Elke Zakel. 2026. “WLCSP Mechanical Reliability - High Speed Pull Testing (Lead-Free Solder Alloys and Electroless Nickel UBM).” IMAPSource Proceedings 2008 (Symposium): 108–14. https://doi.org/10.4071/001c.164094.

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