Thermal Simulations for 4-Layer Stacked IC Packages

Chih-Kuang Yu; Chun-Kai Liu; Ming-Ji Dai Ming-Ji Dai

doi:10.4071/001c.165058

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Yu, Chih-Kuang, Chun-Kai Liu, and Ming-Ji Dai Ming-Ji Dai. 2026. “Thermal Simulations for 4-Layer Stacked IC Packages.” IMAPSource Proceedings 2008 (Symposium): 284–89. https://doi.org/10.4071/001c.165058.

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