ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 23, 2026 EDT
True 3D Through Hole Interconnections Formed by Femto-second Laser Irradi-ation / Wet Etching and Molten Metal Suction Method
True 3D Through Hole Interconnections Formed by Femto-second Laser Irradi-ation / Wet Etching and Molten Metal Suction Method
Nukaga, O., H. Wakioka, S. Yamamoto, T. Suemasu, and H. Hashimoto. 2026. “True 3D Through Hole Interconnections Formed by Femto-Second Laser Irradi-Ation / Wet Etching and Molten Metal Suction Method.” IMAPSource Proceedings 2008 (Symposium): 615–20. https://doi.org/10.4071/001c.165460.