Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead Free Soldering and Gold Wire Bonding

Yukinori Oda; Masayuki Kiso; Seigo Kurosaka; Akira Okada; Kota Kitajima; Shigeo Hashimoto; George Milad; Don Gudeczauskas

doi:10.4071/001c.165901

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Oda, Yukinori, Masayuki Kiso, Seigo Kurosaka, Akira Okada, Kota Kitajima, Shigeo Hashimoto, George Milad, and Don Gudeczauskas. 2026. “Study of Suitable Palladium and Gold Thickness in ENEPIG Deposits for Lead Free Soldering and Gold Wire Bonding.” IMAPSource Proceedings 2008 (Symposium): 924–30. https://doi.org/10.4071/001c.165901.

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