ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 09, 2026 EDT
Electrical, Microstructure and Rheology Properties of the Low-Curing-Temperature Silver Paste with Different Carbon-Chain Type Metallo-Organic Salt Wetting Coating
Electrical, Microstructure and Rheology Properties of the Low-Curing-Temperature Silver Paste with Different Carbon-Chain Type Metallo-Organic Salt Wetting Coating
Lu, Chun-An, Hong-Ching Lin, Sea-Fue Wang, and Chung-Ying Jung. 2026. “Electrical, Microstructure and Rheology Properties of the Low-Curing-Temperature Silver Paste with Different Carbon-Chain Type Metallo-Organic Salt Wetting Coating.” IMAPSource Proceedings 2008 (Symposium): 1103–8. https://doi.org/10.4071/001c.164870.