ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 09, 2026 EDT
Evaluation of DirectFET® Flip Chip Packaging Technology, Lead and Indium Solder Alloys in Extreme Cold Thermal Environments
Evaluation of DirectFET® Flip Chip Packaging Technology, Lead and Indium Solder Alloys in Extreme Cold Thermal Environments
Burmeister, Martin, and Amin Mottiwala. 2026. “Evaluation of DirectFET® Flip Chip Packaging Technology, Lead and Indium Solder Alloys in Extreme Cold Thermal Environments.” IMAPSource Proceedings 2008 (Symposium): 1109–18. https://doi.org/10.4071/001c.164871.