Characterization of Die Attach Adhesives to Identify Contamination Source Present in MEMS Packages

James M. Hochrein; Steven M. Thornberg; Michael S. Baker; Jason R. Brown; John A. Mitchell; Michael I. White; Richard W. Wavrik

doi:10.4071/001c.164863

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Hochrein, James M., Steven M. Thornberg, Michael S. Baker, Jason R. Brown, John A. Mitchell, Michael I. White, and Richard W. Wavrik. 2026. “Characterization of Die Attach Adhesives to Identify Contamination Source Present in MEMS Packages.” IMAPSource Proceedings 2008 (Symposium): 1070–74. https://doi.org/10.4071/001c.164863.

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