Degradation Mechanism of Conductive Adhesive/Sn Interface under High Humidity

Sun Sik Kim; Keun Soo Kim; Seong Jun Kim; Katsuaki Suganuma

doi:10.4071/001c.165455

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Kim, Sun Sik, Keun Soo Kim, Seong Jun Kim, and Katsuaki Suganuma. 2026. “Degradation Mechanism of Conductive Adhesive/Sn Interface under High Humidity.” IMAPSource Proceedings 2008 (Symposium): 588–94. https://doi.org/10.4071/001c.165455.

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