Study of Stress to Solder Joint by Underfill Filling

Akira Tanaka; Akihiko Happoya; Michinobu Inoue; Shun Okayama

doi:10.4071/001c.165351

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Tanaka, Akira, Akihiko Happoya, Michinobu Inoue, and Shun Okayama. 2026. “Study of Stress to Solder Joint by Underfill Filling.” IMAPSource Proceedings 2008 (Symposium): 481–88. https://doi.org/10.4071/001c.165351.

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