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ISSN 2380-4505
Symposium Proceedings
Vol. 2008, Issue Symposium, 2008July 09, 2026 EDT

Electrical and Mechanical Properties of Carbon Nanotube Filled Adhesives on Lead Free PCB Surface Finishes

Keerthivarma Mantena, Janet K. Lumpp, Naveen Velicheti, Midhun Jasti, Poojitha Sirigiri,
adhesiveslead free eraCarbon Nanotube Filled Adhesivessurface finishes
https://doi.org/10.4071/001c.164864
IMAPSource Conference Papers
Mantena, Keerthivarma, Janet K. Lumpp, Naveen Velicheti, Midhun Jasti, and Poojitha Sirigiri. 2026. “Electrical and Mechanical Properties of Carbon Nanotube Filled Adhesives on Lead Free PCB Surface Finishes.” IMAPSource Proceedings 2008 (Symposium): 1075–81. https://doi.org/10.4071/001c.164864.
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