ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 14, 2026 EDT
A Method for Predicting Thermal Conductivity for LTCC with Various Via Densities
A Method for Predicting Thermal Conductivity for LTCC with Various Via Densities
Vincent, Tracey S., and Peter Barnwell. 2026. “A Method for Predicting Thermal Conductivity for LTCC with Various Via Densities.” IMAPSource Proceedings 2008 (Symposium): 319–25. https://doi.org/10.4071/001c.165064.
