ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 10, 2026 EDT
Low-k Interconnect Oriented Lead Free Sn-Cu Bump Process Integration with Sn/Cu Stack Plating
Low-k Interconnect Oriented Lead Free Sn-Cu Bump Process Integration with Sn/Cu Stack Plating
Iijima, Tadashi, Tatsuo Migita, Takashi Togasaki, Masayuki Miura, Toshistune Iijima, Kyoko Kato, Kazuhiro Murakami, et al. 2026. “Low-k Interconnect Oriented Lead Free Sn-Cu Bump Process Integration with Sn/Cu Stack Plating.” IMAPSource Proceedings 2008 (Symposium): 1165–70. https://doi.org/10.4071/001c.164928.