ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 20, 2026 EDT
Evaluation of Innovative Nano-Coated Stencils in Ultra-Fine-Pitch Flip Chip Bumping Processes
Evaluation of Innovative Nano-Coated Stencils in Ultra-Fine-Pitch Flip Chip Bumping Processes
Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl, Andreas Axmann, Carmina Laentzsch, Georg Kleemann,
Manessis, Dionysios, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl, Andreas Axmann, Carmina Laentzsch, and Georg Kleemann. 2026. “Evaluation of Innovative Nano-Coated Stencils in Ultra-Fine-Pitch Flip Chip Bumping Processes.” IMAPSource Proceedings 2008 (Symposium): 438–45. https://doi.org/10.4071/001c.165299.