ISSN 2380-4505
Vol. 2008, Issue Symposium, 2008July 27, 2026 EDT
High Density Interconnect for a High Pin Count Optical IC
High Density Interconnect for a High Pin Count Optical IC
Kums, Gerard, Nienke Bruinsma, and Jan Bex. 2026. “High Density Interconnect for a High Pin Count Optical IC.” IMAPSource Proceedings 2008 (Symposium): 883–88. https://doi.org/10.4071/001c.165803.
