A Comparison Study on SnAgNiCo and Sn3.8Ag0.7Cu C5 Lead Free Solder System

Eu Poh Leng; Min Ding; Wong Tzu Ling; Nowshad Amin; Ibrahim Ahmad; Mok Yong Lee; A.S.M.A. Haseeb

doi:10.4071/001c.165913

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Leng, Eu Poh, Min Ding, Wong Tzu Ling, Nowshad Amin, Ibrahim Ahmad, Mok Yong Lee, and A.S.M.A. Haseeb. 2026. “A Comparison Study on SnAgNiCo and Sn3.8Ag0.7Cu C5 Lead Free Solder System.” IMAPSource Proceedings 2008 (Symposium): 962–69. https://doi.org/10.4071/001c.165913.

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